| 发明名称 | Method of manufacturing liquid ejection head, and liquid ejection head | ||
| 摘要 | There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths. | ||
| 申请公布号 | US9085142(B2) | 申请公布日期 | 2015.07.21 |
| 申请号 | US201414167919 | 申请日期 | 2014.01.29 |
| 申请人 | Canon Kabushiki Kaisha | 发明人 | Ono Takayuki;Furukawa Masao;Ishikawa Masashi;Hinami Jun;Shibata Takeshi;Shimamura Ryo;Enomoto Takanori;Otaka Shimpei;Takahashi Tomohiro |
| 分类号 | B41J2/14;B41J2/05;B41J2/16 | 主分类号 | B41J2/14 |
| 代理机构 | Canon USA Inc. IP Division | 代理人 | Canon USA Inc. IP Division |
| 主权项 | 1. A method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction, the method comprising: applying a bonding agent on the major surface around each of the supply paths; spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied; moving the recording element substrate and the supporting member that are connected to each other with the bonding agent relative to each other in a first direction along the major surface; and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths. | ||
| 地址 | Tokyo JP | ||