| 发明名称 |
Heat sink structure with radio frequency absorption |
| 摘要 |
According to embodiments of the invention, a heat sink structure may be provided. The heat sink structure may include a first surface adapted to connect to an electronic component. The heat sink structure may also include a second surface adapted to provide heat transfer. The heat sink structure may also include a coating of radio-frequency absorbing material covering at least a portion of the second surface. |
| 申请公布号 |
US9089074(B2) |
申请公布日期 |
2015.07.21 |
| 申请号 |
US201213679591 |
申请日期 |
2012.11.16 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Gillard Edward C.;Gilliland Don A.;Johnson David B.;Wurth Dennis J. |
| 分类号 |
F28F21/00;H05K7/20;H05K9/00;H01L23/373;H01L23/552;F28F13/18 |
主分类号 |
F28F21/00 |
| 代理机构 |
|
代理人 |
Lowry Penny L.;Williams Robert |
| 主权项 |
1. A heat sink structure comprising:
a conductive material; a first surface of the conductive material adapted to connect to an electronic component; a second surface of the conductive material adapted to provide heat transfer away from the electronic component; and a coating of insulative radio-frequency absorbing material covering a first portion of the second surface, the coating of insulative radio-frequency absorbing material not covering a second portion of the second surface. |
| 地址 |
Armonk NY US |
