Chip-component structure

摘要

A chip-component structure includes an interposer on which a multilayer capacitor is mounted. The interposer includes component connecting electrodes, external connection electrodes, side electrodes, and in-hole electrodes. The component connecting electrodes and the external connection electrodes are electrically connected by the side electrodes and the in-hole electrodes. Outer electrodes of the capacitor are joined to the component connecting electrodes.

主权项

1. A chip-component structure, comprising:
a multilayer capacitor including a laminated body including a plurality of dielectric layers and a plurality of internal electrodes stacked on each other, and outer electrodes provided on opposite longitudinal component end surfaces of the laminated body and electrically connected to respective ones of the plurality of internal electrodes; and an interposer including a substrate including a through-hole opened between both principal surfaces thereof, a component connecting electrode provided on a component mount surface defining one of the principal surfaces of the substrate and joined to the outer electrodes, an external connection electrode provided on a substrate mount surface defining the other principal surface of the substrate opposite to the component mount surface, and in-hole electrodes provided in the through-hole to connect the component connecting electrode and the external connection electrode; wherein the in-hole electrodes connected to the different outer electrodes of the multilayer capacitor are provided in the same through-hole.