摘要 |
The present invention provides a transfer method transferring a substrate held between a placing unit and a cover from a carrier including the placing unit wherein the substrate is placed and the cover superposed on an upper surface of the placing unit in close contact. The transfer method comprises: a holding step of holding the substrate and the cover on the placing unit by a holding apparatus; and a moving step of moving the holding apparatus to move the substrate and the cover from the placing unit to a transfer destination. In the holding step, the cover is held by a cover holding unit of the holding apparatus, and the substrate is held by a substrate holding unit of the holding apparatus in parallel postures of the cover and the substrate. |