| 摘要 |
<p>The present invention relates to a method for manufacturing a semiconductor package substrate, having a simple process and easily performing wiring with a semiconductor device, and to the semiconductor package substrate manufactured by using the same, and more specifically, to a method for manufacturing a semiconductor package substrate, comprising the steps of: forming a groove or a trench on one surface of a base substrate of a conductive material; filling the groove or the trench with a resin; etching the other surface of the base substrate so that the resin filling the groove or the trench is exposed; forming a first conductive layer which is integral on an exposed part in one surface of the base substrate of the resin and one surface of the base substrate; performing electroplating and forming a second conductive layer on the other surface of the base substrate; and removing the first conductive layer, and to the semiconductor package substrate using the same.</p> |
