| 摘要 |
The invention relates to an electronic device comprising at least one electronic component mounted on a support and surrounded by a deformable envelope containing a thermally conductive and electrically insulating liquid, said device comprising a heat dissipation plate which is substantially parallel to the support and at a distance therefrom, and means for heat transfer by conduction between the envelope and the plate, the thermally conductive and electrically insulating liquid being selected and the envelope being arranged such that a thermal expansion of the oil generates a force pressing the envelope against the means for heat exchange by conduction. |
