发明名称 |
LASER DRILLING METHOD AND LASER DRILLING SYSTEM |
摘要 |
A laser drilling method and a laser drilling system. The laser drilling method comprises: a step of forming a hole boundary: outputting a pulse laser beam (100), scanning a substrate (10) where a hole is to be drilled, and forming a boundary cutting groove (20) of a preformed hole; a step of heating a material in the hole: outputting a CO2 laser beam (200), aligning the CO2 laser beam (200) with the preformed hole, and heating a substrate material (30) of the preformed hole for a preset period of time; and a step of forming a hole: cooling the substrate material (30) of the preformed hole, so that the substrate material (30) is deformed and then is disengaged from the substrate (10) where the hole is to be drilled. |
申请公布号 |
WO2015103893(A1) |
申请公布日期 |
2015.07.16 |
申请号 |
WO2014CN87917 |
申请日期 |
2014.09.30 |
申请人 |
BOE TECHNOLOGY GROUP CO., LTD.;HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
DONG, DAI;GONG, WEIGANG;HUANG, YANG;TAO, SHENG |
分类号 |
B23K26/382;B23K26/03;B23K26/0622;B23K26/14;B23K26/16;B23K26/70;C03B33/08 |
主分类号 |
B23K26/382 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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