半导体封装件及其制法;SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

一种半导体封装件及其制法，该半导体封装件系包括：具有相对之第一表面及第二表面、复数第一电性连接垫及复数第二电性连接垫的封装基板，而该第一电性连接垫及第二电性连接垫系形成于该第一表面上；具有相对之作用面与非作用面的晶片，系以其作用面覆晶接置于该第一电性连接垫上；形成于该第二电性连接垫上的导电柱；以及形成于该第一表面上，并包覆该晶片及该导电柱，且具有外露该导电柱之顶面的开孔的第一封装胶体。本发明能提高封装件之密度及防止晶片及互连结构受到水气入侵的影响。; a chip having opposite an active surface and an inactive surface, and is flip-chip in contact with the first electrical connection pads via the active surface; a conductive column formed on the second electrical connection pad; and a first package colloid formed on the first surface, covering the chip and the conductive column, and having opening for exposing the top surface of the conductive column. This invention is able to improve density of the package, and prevent chip and interconnection structure subject to the water vapor damage.