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发明名称
安装装置及安装方法
摘要
本发明提供一种对设置于基板之复数个安装区块之每一个以利用焊料之方法安装子基板时,缩短安装周期时间而提升生产性的安装装置及安装方法。具体而言,提供一种安装装置及安装方法,该安装装置具备:加压机构,其于基板之安装区块将子基板加压;及基板平台,其载置基板;基板平台设置有基板搬入区域与基板搬出区域,且具备将基板自基板搬入区域移动至基板搬出区域之基板移动机构,基板搬入区域与基板搬出区域系以与基板之安装区块对应之区划利用区块而划分,各区块包含具备可加热至使焊料熔融之温度之加热机构的区块、及保持为助焊剂不会挥发之温度以下的区块,且于基板搬入区域具备至少1个保持为助焊剂不会挥发之温度以下的区块。
申请公布号
TW201528408
申请公布日期
2015.07.16
申请号
TW103141074
申请日期
2014.11.26
申请人
东丽工程股份有限公司 TORAY ENGINEERING CO., LTD.
发明人
千田雅史 SENDA, MASAFUMI;寺田胜美 TERADA, KATSUMI
分类号
H01L21/67(2006.01);H01L21/768(2006.01);H01L23/488(2006.01)
主分类号
H01L21/67(2006.01)
代理机构
代理人
陈长文
主权项
地址
日本 JP
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