| 发明名称 |
Packaging through Pre-Formed Metal Pins |
| 摘要 |
A package includes first package component and a second package component. The first package component includes a first electrical connector at a surface of the first package component, and a first solder region on a surface of the first electrical connector. The second package component includes a second electrical connector at a surface of the second package component, and a second solder region on a surface of the second electrical connector. A metal pin has a first end bonded to the first solder region, and a second end bonded to the second solder region. |
| 申请公布号 |
US2015200171(A1) |
申请公布日期 |
2015.07.16 |
| 申请号 |
US201414153691 |
申请日期 |
2014.01.13 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company |
发明人 |
Yu Chen-Hua;Hwang Chien Ling;Lin Yeong-Jyh |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a first package component comprising:
a first electrical connector at a surface of the first package component; anda first solder region on a surface of the first electrical connector; a second package component comprising:
a second electrical connector at a surface of the second package component; anda second solder region on a surface of the second electrical connector; and a metal pin comprising:
a first end bonded to the first solder region; anda second end bonded to the second solder region. |
| 地址 |
Hsin-Chu TW |
