METHOD FOR PRODUCING OPTOELECTRONIC SEMICONDUCTOR COMPONENTS, LEADFRAME ASSEMBLY AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT

摘要

In one embodiment, the method is configured for producing optoelectronic semiconductor components (1) and includes the steps of:
providing a leadframe assembly (20) with a multiplicity of leadframes (2), each having at least two leadframe parts (21, 22);forming at least a part of the leadframe assembly (20) with a housing material for housing bodies (4);dividing the leadframe assembly (20) between at least one part of the columns (C) and/or the rows (R), wherein the leadframes (2) remain arranged in a matrix-like manner;equipping the leadframes (2) with at least one optoelectronic semiconductor chip (3);testing at least one part of the leadframes (2) equipped with the semiconductor chips (3) and formed with the housing material after the step of dividing; andseparating to form the semiconductor components (1) after the step of forming and after the step of testing.

主权项

1. Method for producing optoelectronic semiconductor components having the steps of:
providing a leadframe assembly with a multiplicity of leadframes arranged in rows and columns, wherein each of the leadframes includes at least two leadframe parts which follow one another along the rows and each of the leadframes is provided for one of the semiconductor components, forming at least a part of the leadframe assembly with a housing material for housing bodies of the semiconductor components, dividing the leadframe assembly along and between at least one part of the columns and/or the rows, wherein the leadframes remain arranged in a matrix-like manner, equipping the leadframes with at least one optoelectronic semiconductor chip, testing at least one part of the leadframes equipped with the semiconductor chips and formed with the housing material after the step of dividing, and separating to form the semiconductor components after the step of forming and after the step of testing.