| 发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor manufacturing apparatus includes a chamber configured to house a semiconductor substrate therein. A vacuum part depressurizes inside of the chamber. A heater heats the semiconductor substrate. The vacuum part depressurizes the inside of the chamber in order to freeze water attached to the semiconductor substrate. The heater heats the semiconductor substrate in order to sublimate water frozen on the semiconductor substrate. |
| 申请公布号 |
US2015200086(A1) |
申请公布日期 |
2015.07.16 |
| 申请号 |
US201414298485 |
申请日期 |
2014.06.06 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Yokoyama Noboru |
| 分类号 |
H01L21/02;F26B3/00 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor manufacturing apparatus comprising:
a chamber configured to house a semiconductor substrate therein; a vacuum part configured to depressurize inside of the chamber; and a heater configured to heat the semiconductor substrate, wherein the vacuum part depressurizes the inside of the chamber in order to freeze water attached to the semiconductor substrate, and the heater heats the semiconductor substrate in order to sublimate water frozen on the semiconductor substrate. |
| 地址 |
Tokyo JP |
