POWER MODULE PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

The power module package according to the present invention comprises: a heat sink board in which a stepped part along with the boundary exists; a semiconductor chip mounted on a mounting surface of the heat sink board; an external connecting terminal electrically connected to a semiconductor chip by being located at the outer circumference of the heat sink board and protruded to the outside; a wire electrically connected to the semiconductor chip and the external connecting terminal; a molding unit to seal the semiconductor chip and a part of the heat sink board. Especially, the molding unit does not invade the exposed surface of the heat sink board through the stepped unit. Furthermore, the present invention includes a manufacturing method capable of preventing a flash of the molding unit from being formed on the exposed surface.