发明名称 RESIN SEALING DEVICE, RESIN SUPPLY DEVICE, AND RESIN SUPPLY METHOD
摘要 PROBLEM TO BE SOLVED: To reduce molding defects such as a defect to be unfilled.SOLUTION: In a resin supply section, a base resin portion 27a made of a granular resin 27 is formed on a workpiece W, and a middle high resin portion 27b that is made of the granular resin 27 of which the amount is smaller than that of the granular resin 27 forming the base resin portion 27a is formed on the base resin portion 27a. In a press portion 21, an upper mold 43 is brought into contact with the middle high resin portion 27b by coming the upper mold 43 and a lower mold 44 in contact with the workpiece W mounted on the lower mold 44, a melted resin is expanded onto the base resin portion 27a, and the inside of a cavity 45 is filled with the resin.
申请公布号 JP2015128908(A) 申请公布日期 2015.07.16
申请号 JP20150078311 申请日期 2015.04.07
申请人 APIC YAMADA CORP 发明人 FUJISAWA MASAHIKO;OYA HIDETOSHI;ASAHI SHINICHI
分类号 B29C43/34;B29C31/04;B29C43/18 主分类号 B29C43/34
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