| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting element such as an LED which prevents peeling of a protection layer and cracks to achieve excellent reliability, and a method for manufacturing the light emitting element.SOLUTION: A light emitting element 10 comprises: first bonding layers 35, 36 formed on a support substrate; a semiconductor structure layer 17 which is arranged on the first bonding layers, includes a luminescent layer 13 and has a second bonding layer bonded to the first bonding layers, on an undersurface; and an insulating protection film 37 which covers a top face and lateral faces of the semiconductor structure layer and surfaces of the first bonding layers. Each of the first bonding layers includes, from the top in order, a first metal layer composed of Au, and a second metal layer composed of metal having higher adhesion with the insulating protection film than Au, and the metal of the second metal layer appears on a surface of the first metal layer covered with the insulating protection film. |
