| 发明名称 |
Packaging Methods for Semiconductor Devices, Packaged Semiconductor Devices, and Design Methods Thereof |
| 摘要 |
Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof are disclosed. In some embodiments, a method of packaging a plurality of semiconductor devices includes providing a first die, and coupling second dies to the first die. An electrical connection is formed between the first die and each of the second dies. A portion of each of the electrical connections is disposed between the second dies. |
| 申请公布号 |
US2015200182(A1) |
申请公布日期 |
2015.07.16 |
| 申请号 |
US201414157364 |
申请日期 |
2014.01.16 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Wang Chuei-Tang;Liu Monsen;Yu Chen-Hua |
| 分类号 |
H01L25/065;G06F17/50;H01L25/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of packaging a plurality of semiconductor devices, the method comprising:
providing a first die; coupling a plurality of second dies to the first die; and forming an electrical connection between the first die and each of the plurality of second dies, wherein a portion of each of the electrical connections is disposed between the plurality of second dies. |
| 地址 |
Hsin-Chu TW |
