SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor structure includes a conductive bump for disposing over a substrate and an elongated ferromagnetic member surrounded by the conductive bump, including a first end and a second end, and extending from the first end to the second end, the elongated ferromagnetic member is disposed substantially orthogonal to the substrate to dispose the conductive bump at a predetermined orientation and at a predetermined position of the substrate. Further, a method of manufacturing a semiconductor structure includes providing a substrate, forming a conductive trace within the substrate, applying an electric current passing through the conductive trace to generate an electromagnetic field and disposing a conductive bump including an elongated ferromagnetic member in a predetermined orientation and at a predetermined position above the substrate in response to the electromagnetic field generated by the conductive trace.

主权项

1. A semiconductor structure, comprising:
a conductive bump for disposing over a substrate; and an elongated ferromagnetic member surrounded by the conductive bump, including a first end and a second end, and extended from the first end to the second end, wherein the elongated ferromagnetic member is disposed substantially orthogonal to the substrate to dispose the conductive bump at a predetermined orientation and at a predetermined position over the substrate.