THERMAL IMPROVEMENT FOR HOTSPOTS ON DIES IN INTEGRATED CIRCUIT PACKAGES

摘要

Methods and apparatuses for improved integrated circuit (IC) packages are described herein. In an aspect, an IC device package includes an IC die having a contact pad, where the contact pad is located on a hotspot of the IC die. The hotspot is thermally coupled to a thermal interconnect member. In an aspect, the package is encapsulated in a mold compound. In a further aspect, a heat spreader is attached to the mold compound, and is thermally coupled to the thermal interconnect member. In another aspect, a thermal interconnect member thermally is coupled between the heat spreader and the substrate.

主权项

1. A method of manufacturing an integrated circuit (IC) package, the method comprising:
attaching an IC die to a substrate, the IC die having a contact pad located at a hotspot on a surface of the IC die that radiates more heat relative to a second location on the surface of the IC die during operation of the IC die; coupling at least one wire bond between the IC die and the substrate; coupling a thermal interconnect member to the contact pad; and encapsulating the IC die, the at least one wire bond, and at least a portion of the thermal interconnect member in a mold compound.