| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board in which location accuracy of a light emitting diode is high; and to provide a printed circuit board using the printed wiring board and a printed circuit board manufacturing method.SOLUTION: A printed wiring board includes an insulating base film, and a conductive pattern which is laminated on a surface of the base film and has a plurality of land parts and wiring parts, in which a plurality of light emitting diodes are mounted on the plurality of land parts via solder. The land parts are laminated, in planar view, on connection scheduled regions of connection terminals of the light emitting diodes which are connection targets of the land parts, and on peripheral regions which lead to outer edges of the connection scheduled regions; an average width of the peripheral regions is not less than 10μm and not more than 50μm. It is preferable that one or a plurality of wiring parts are connected to the land part and a total projection width of the one or the plurality of wiring parts to one side of the land part is not greater than 20% of a length of the one side.</p> |
