| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for optical semiconductor device excellent not only in the initial light reflectance but also the long term lightfastness, and having a high glass-transition temperature, and to provide an optical semiconductor device using the same.SOLUTION: In an optical semiconductor device including a metal lead frame consisting of a first plate 1 and a second plate 2, and a reflector 4 surrounding an optical semiconductor element 3 mounted on the metal lead frame, the formation material of the reflector 4 is composed of an epoxy resin composition for optical semiconductor device containing (A)-(E) described below. The total content of (C) and (E) is 70-90 vol% of the entire epoxy resin composition, and the content of (D) is 0.1-8 wt% for (C). (A) Epoxy resin. (B) A hardener mainly composed of a liquid hardener. (C) Zirconium oxide. (D) A silane-based compound. (E) An inorganic filler. |
