COMPONENT MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a component mounting device in which, even when the size of a component support member for supporting a film-like potion of a component mounted on a substrate from below is changed, the component support member is prevented from being in contact with other components on the device.SOLUTION: The component mounting device includes: a component mounting operation part 22b for mounting a component 4 having a film-like portion 4a on a substrate 2; a component press-bonding operation part (a first component press-bonding operation part 22c and a second component press-bonding operation part 22d) for press-bonding the component 4 mounted on the substrate 2 by the component mounting operation part 22b on the substrate 2; a substrate placement stage 53 being movable between the component mounting operation part 22b and the component press-bonding operation part; a component support member 54 provided on the substrate placement stage 53, and supporting the film-like portion 4a of the component 4 mounted on the substrate 2 by the component mounting operation part 22b from below; and size detection means (a size detection sensor 64S and a size detection part 24S of a control device 24) for detecting the size of the component support member 54.