| 发明名称 |
PAD STRUCTURE DESIGN IN FAN-OUT PACKAGE |
| 摘要 |
A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of non-solder electrical connectors underlying and electrically coupled to the plurality of redistribution lines. The plurality of non-solder electrical connectors includes a corner electrical connector. The corner electrical connector is elongated. An electrical connector is farther away from the corner than the corner electrical connector, wherein the electrical connector is non-elongated. |
| 申请公布号 |
US2015200185(A1) |
申请公布日期 |
2015.07.16 |
| 申请号 |
US201414157054 |
申请日期 |
2014.01.16 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Jeng Shin-Puu;Yeh Der-Chyang;Chen Hsien-Wei |
| 分类号 |
H01L25/065;H01L23/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a bottom package comprising:
a corner;a first device die;a plurality of redistribution lines underlying the first device die; anda plurality of non-solder electrical connectors underlying and electrically coupled to the plurality of redistribution lines, wherein the plurality of non-solder electrical connectors comprises:
a corner electrical connector, wherein the corner electrical connector is elongated; andan electrical connector farther away from the corner than the corner electrical connector, wherein the electrical connector is non-elongated. |
| 地址 |
Hsin-Chu TW |
