| 发明名称 |
BONDING APPARATUS AND METHOD |
| 摘要 |
A bonding apparatus includes a wafer stage, a first chip stage, a first transporting device, a second stage and a second transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second transporting device is used for transporting the second chip from the second chip stage onto the wafer. |
| 申请公布号 |
US2015200118(A1) |
申请公布日期 |
2015.07.16 |
| 申请号 |
US201414157271 |
申请日期 |
2014.01.16 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
WU Pei-Shan;HU Yi-Ting;LEE Ming-Tan;WANG Yu-Lin;CHANG Yuh-Sen;SHIN Pin-Yi;CHEN Wen-Ming;CHEN Wei-Chih;CHIU Chih-Yuan |
| 分类号 |
H01L21/67;H01L21/50;H01L21/677;H01L21/68;H01L21/687;H01L21/683 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bonding apparatus, comprising:
a wafer stage for holding a wafer; a first chip stage for holding at least one first chip; a first transporting device for transporting the first chip from the first chip stage onto the wafer; a second chip stage for holding at least one second chip; and a second transporting device for transporting the second chip from the second chip stage onto the wafer. |
| 地址 |
Hsinchu TW |
