发明名称 THERMOSETTING RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE OBTAINED BY USING THE COMPOSITION, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for an optical semiconductor device, which exhibits high initial reflectance for light even when the composition is molded into a thin form, and exhibits excellent long-term light fastness and resistance to discoloration by heating, and to provide a lead frame for an optical semiconductor device obtained by using the composition, and an optical semiconductor device.SOLUTION: The optical semiconductor device includes a metal lead frame composed of a first plate 1 and a second plate 2, and a reflector 4 formed to enclose an optical semiconductor element 3 mounted on the metal lead frame, having a thickness of 0.2 mm or less in a thinnest portion. The reflector 4 is made of a thermosetting resin composition for an optical semiconductor containing the following (A) and (B) components: (A) a thermosetting resin; and (B) zirconium oxide having a ratio (D95/D5) of 1 to 100, where D95 represents a grain size at 95% cumulative frequency in a cumulative grain size distribution in a cured product of the thermosetting resin, and D5 represents a grain size at 5% cumulative frequency.
申请公布号 JP2015129257(A) 申请公布日期 2015.07.16
申请号 JP20140227951 申请日期 2014.11.10
申请人 NITTO DENKO CORP 发明人 FUKAMICHI YUICHI;BABA TOSHIKAZU;FUKUYA KAZUHIRO
分类号 C08L63/00;C08K3/22;C08L83/04;H01L33/60 主分类号 C08L63/00
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