| 摘要 |
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which reduces unreacted crosslinking agents at the time of curing, has excellent heat resistance, reduces cured film residual stress, and can inhibit warpage.SOLUTION: A positive photosensitive resin composition comprises (A) at least one polymer selected from the group consisting of polyimide, polybenzoxazole and their precursor, (B) a compound that receives light irradiation to generate acid, (C) a heat crosslinking agent, and (D) acrylic resin soluble in alkaline aqueous solution. |
