发明名称 HALF-CUT-OFF PROCESSING METHOD FOR RESIN FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a half-cut-off processing method for a resin film, which can perform a half-cut-off processing easily with a pair of revolving rolls, and a half-cut-off processing on both front and rear sides of the resin film easily.SOLUTION: A half-cut-off processing method of a resin film includes: transferring laminated resin films 10 and 10 between a pair of revolving rolls 21 and 22; and pressing slits 24 formed on an outer circumference of at least one role 21 onto the laminated resin films 10 and 10, thereby performing a half-cut-off processing for cutting the laminated resin films 10 and 10 in a thickness direction by sharp edges 24a and 24a on at least one side edge of the slits 24.</p>
申请公布号 JP2015128810(A) 申请公布日期 2015.07.16
申请号 JP20140001809 申请日期 2014.01.08
申请人 TOYO SEIKAN KAISHA LTD 发明人 AIKAWA TAKAYUKI;TSURUMOTO TAKASHI;NYU KEISUKE
分类号 B26D3/08;B26D1/40;B65D33/00 主分类号 B26D3/08
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