| 发明名称 |
Ag-Pd-Cu-Co ALLOY FOR USES IN ELECTRICAL/ELECTRONIC DEVICES |
| 摘要 |
The present invention is to provide metal material for electric/electronic devices, which is comprised of 20 to 50 mass % of Ag or 20 to 50 mass % of Pd to 10 to 40 mass % of Cu, 5 to 30 mass % of Co, said alloy has low contact resistance, good oxidation resistance, high hardness, good workability, and low wettability and anti-erosion property to Sn alloy solder. |
| 申请公布号 |
US2015197834(A1) |
申请公布日期 |
2015.07.16 |
| 申请号 |
US201514670937 |
申请日期 |
2015.03.27 |
| 申请人 |
Takuriki Honten Co., Ltd. |
发明人 |
Kumita Hideo;Shishino Ryu;Uruu Keiju |
| 分类号 |
C22C30/06;C22C30/04;H01B1/02;C22C5/06;C22C5/04;C22C9/00;C22C30/02;C22C5/08 |
主分类号 |
C22C30/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A metal material for use in an electric/electronic device, the metal material comprising an alloy which contains 20 to 50 mass % of Ag, 20 to 50 mass % of Pd, 10 to 40 mass % of Cu and 0.5 to 30 mass % of Co, in which the metal material has low wettability to Sn alloy solder and anti-erosion property to Sn alloy solder. |
| 地址 |
Tokyo JP |
