| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a module capable of obtaining a small acoustic wave device having good electric characteristics.SOLUTION: A module 100 includes: a module substrate 10; and an acoustic wave device 200 buried in the module substrate 10 and including a SAW chip 22 which is mounted on an upper surface of a package substrate 20, a metal sealing part 44 which is provided on the package substrate 20 and seals the SAW chip 22, and a ground terminal 36b which is provided on a lower surface of the package substrate 20 and is electrically connected with the SAW chip 22. The ground terminal 36b and the sealing part 44 are electrically connected with ground through via wiring 16 provided on the module substrate 10 and are not electrically connected with each other in the acoustic wave device 200.</p> |
