| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device that allows high-density mounting of semiconductor chips.SOLUTION: First and second semiconductor chips 7 and 8 are die bonded to a multilayer wiring board 1 by a first die-bonding material 9 and a second die-bonding material 10 respectively. A groove 11 is provided between the first semiconductor chip 7 and the second semiconductor chip 8 in the multilayer wiring board 1. A depth e of the groove 11 is provided so as to prevent interference between the first die-bonding material 9 and the second die-bonding material 10.</p> |
