| 发明名称 |
Package Having Substrate With Embedded Metal Trace
Overlapped by Landing Pad |
| 摘要 |
An embodiment package includes a conductive pillar mounted on an integrated circuit chip, the conductive pillar having a stepper shape, a metal trace partially embedded in a substrate, the metal trace having a bonding pad portion protruding from the substrate, and a solder feature electrically coupling the conductive pillar to the bonding pad portion of the metal trace. |
| 申请公布号 |
US2015200172(A1) |
申请公布日期 |
2015.07.16 |
| 申请号 |
US201414155949 |
申请日期 |
2014.01.15 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lii Mirng-Ji;Liang Yu-Min;Chen Yu-Feng |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package, comprising:
a conductive pillar mounted on an integrated circuit chip, the conductive pillar having a stepper shape; a metal trace partially embedded in a substrate, the metal trace having a bonding pad portion protruding from the substrate; and a solder feature electrically coupling the conductive pillar to the bonding pad portion of the metal trace. |
| 地址 |
Hsin-Chu TW |
