MINIATURIZED SMD DIODE PACKAGE AND PRSCESS FOR PRODUCING THE SAME

摘要

A miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from a process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.

主权项

1. A miniaturized SMD diode package, comprising:
a first diode chip, formed from a TVS diode, a Schottky diode, a switch diode, a Zener diode or a rectifier diode and having a bottom surface provided with a positive electrode and a negative electrode; a bottom circuit board, formed from a ceramic plate, a plastic plate, a composite sheet or a heat-dissipated plate; two circuit electrodes, being separately deposited on the bottom circuit board and electrically connected to the positive electrode and the negative electrode on the bottom surface of the first diode chip, respectively; an encapsulation, formed from a ceramic material or a plastic material to integrate with the bottom circuit board, to encase the first diode chip and the two circuit electrodes, and to allow the two circuit electrodes each have one end extended to and exposed at one end of the encapsulation; and two outer electrodes, formed from silver (Ag), tin (Sn), copper (Cu), gold (Au), nickel (Ni), palladium (Pd) or platinum (Pt), each covering one end of the integrated structure formed by the encapsulation and the bottom circuit board, and each electrically connected to the corresponding circuit electrode exposed at one end of the encapsulation, respectively.