发明名称 SYSTEMS AND METHODS FOR REMOVING OVERSPRAY
摘要 Systems and methods are disclosed for removing overspray from a substrate. A coating material may be plasma sprayed on a substrate utilizing Suspension Plasma Spray or Solution Precursor Plasma Spray. The plasma spray may deposit loosely adhered overspray on the substrate. A pressurized gas may be directed at the overspray to remove the overspray from the component.
申请公布号 US2015197840(A1) 申请公布日期 2015.07.16
申请号 US201414575395 申请日期 2014.12.18
申请人 United Technologies Corporation 发明人 Bochiechio Mario P.;Hazel Brian T.;Serra Jessica L.
分类号 C23C4/18;C23C4/12 主分类号 C23C4/18
代理机构 代理人
主权项 1. A method of removing overspray comprising: plasma spraying a substrate with a coating material, wherein the plasma spraying deposits an overspray on the substrate; and directing a separate pressurized gas at the overspray, wherein the pressurized gas carries a media.
地址 Hartford CT US