发明名称 |
SYSTEMS AND METHODS FOR REMOVING OVERSPRAY |
摘要 |
Systems and methods are disclosed for removing overspray from a substrate. A coating material may be plasma sprayed on a substrate utilizing Suspension Plasma Spray or Solution Precursor Plasma Spray. The plasma spray may deposit loosely adhered overspray on the substrate. A pressurized gas may be directed at the overspray to remove the overspray from the component. |
申请公布号 |
US2015197840(A1) |
申请公布日期 |
2015.07.16 |
申请号 |
US201414575395 |
申请日期 |
2014.12.18 |
申请人 |
United Technologies Corporation |
发明人 |
Bochiechio Mario P.;Hazel Brian T.;Serra Jessica L. |
分类号 |
C23C4/18;C23C4/12 |
主分类号 |
C23C4/18 |
代理机构 |
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代理人 |
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主权项 |
1. A method of removing overspray comprising:
plasma spraying a substrate with a coating material, wherein the plasma spraying deposits an overspray on the substrate; and directing a separate pressurized gas at the overspray, wherein the pressurized gas carries a media. |
地址 |
Hartford CT US |