嵌埋有晶片之封装结构的制法;MANUFACTURING METHOD OF WAFER-EMBEDDING PACKAGE STRUCTURE

摘要

一种嵌埋有晶片之封装结构的制法，系包括：准备一其上形成有第一线路层之承载板，该第一线路层系具有复数第一电性连接垫及第二电性连接垫；以覆晶方式接置至少一晶片于该第一电性连接垫上；将介电层形成在该承载板上以包覆该晶片及该第一线路层，并令该介电层具有连接该承载板的第一表面与其相对之第二表面；将贯穿该介电层且连接该第二电性连接垫的复数导电通孔形成；将电性连接该导电通孔的第二线路层形成在该介电层之第二表面上；以及移除该承载板。本发明能提高晶片之电性连接或信赖性测试的良率。; the first electrical connection pad flip-chip in contact with at least one wafer; forming a dielectric layer on the carrying plate to cover the wafer and the first wiring layer, the dielectric layer has a first surface and an opposite second surface to connect the carrying plate; forming a conductive through-hole to penetrate the dielectric layer and connect the second electrical connection pad; forming a second wiring layer that electrically connects the conductive through-hole on the second surface of the dielectric layer; and removing the carrying plate. This invention can enhance the yield of wafer in the electrical connection and reliability test.