基板贴合装置、显示装置用构件的制造装置及制造方法;SUBSTRATE BONDING APPARATUS, MANUFACTURING APPARATUS FOR DISPLAY PANEL AND METHOD THEREOF

摘要

本发明均匀地按压黏合层来使基板与黏合层密接，而减少空隙的产生。基板贴合装置20是经由形成在液晶面板S1的表面上的黏合层R1而将液晶面板S1与保护面板S2贴合，其包括：作为支撑部的下侧板22，支撑液晶面板S1；作为保持部的上侧板23，在与液晶面板S1对向的位置上保持保护面板S2；升降机构25，对上侧板23进行驱动，由此经由黏合层R1而将液晶面板S1与保护面板S2贴合；弹性片24，一部分埋入至下侧板22中，一面经由液晶面板S1而按压黏合层R1一面进行收缩。; an upper plate 23 as a holding part configured against the liquid crystal panel S1 to hold the protective panel S2; a lift mechanism 25 driving the upper plate 23, so that the liquid crystal panel S1 and the protective panel S2 are bonded through the adhesive layer R1; an elastic sheet 24 having a part buried in the lower plate 22, which presses the adhesive layer R1 via the liquid crystal panel S1 while also contracting.