本发明之黏合方法包含下列步骤：透过接着剂层(3)贴合基板(1)与支撑上述基板(1)之支撑板(2)，且使用板状构件(30)按压之按压步骤；及于上述按压步骤之后，将透过上述接着剂层(3)贴合之上述基板(1)与上述支撑板(2)放置于比进行上述按压步骤之环境气压高之气压环境下之气压调整步骤。; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.
