| 发明名称 |
Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices |
| 摘要 |
Systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a system for processing semiconductor devices includes a radiation energy source, a support, and a tool disposable between the support and the radiation energy source. The tool includes apertures adapted to retain a package component over the support. The system includes a cooling device proximate the support. |
| 申请公布号 |
US2015201462(A1) |
申请公布日期 |
2015.07.16 |
| 申请号 |
US201414155050 |
申请日期 |
2014.01.14 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lin Hsiu-Jen;Chen Wei-Yu;Ang Ai-Tee;Cheng Ming-Da;Liu Chung-Shi |
| 分类号 |
H05B3/02 |
主分类号 |
H05B3/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system for processing semiconductor devices, comprising:
a radiation energy source; a support; a tool disposable between the support and the radiation energy source, wherein the tool comprises a plurality of apertures adapted to retain a package component over the support; and a cooling device proximate the support. |
| 地址 |
Hsin-Chu TW |
