ELECTRICALLY CONDUCTIVE FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of eliminating voids between a conductive film adhesive and an adherend and securing an area of contact between the conductive film adhesive and the adherend, a film adhesive used with the method, and a dicing tape with the film adhesive.SOLUTION: A method for manufacturing a semiconductor device comprises the steps of: die-bonding a semiconductor chip to an adherend via a conductive film adhesive; thermally hardening the conductive film adhesive by heating it under pressure after the die-bonding the semiconductor chip to the adherend.