| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semiconductor device capable of improving positioning accuracy of a lid while suppressing the cost.SOLUTION: A package 1 includes a bottom plate 2 and a side wall 3 formed on the outer periphery of the bottom plate 2. A semiconductor element 4 is placed on the bottom plate 2. A lid 5 is joined to an upper part of the side wall 3 so as to cover the semiconductor element 4. A curved surface is formed inside the package 1 at the upper part of the side wall 3. A curved surface is formed on the outer periphery of the lower surface of the lid 5. The curved surface of the side wall 3 is in contact with the curved surface of the lid 5.</p> |
