CONDUCTIVE FILM ADHESIVE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a film adhesive capable of suppressing occurrence of malfunction in the wire bonding process.SOLUTION: A conductive film adhesive is used for a method for manufacturing a semiconductor device comprising a step for die-bonding a semiconductor chip to an adherend via the conductive film adhesive; and a step for thermal hardening the conductive film adhesive by heating it at 200°C to 260°C for 1 to 24 hours after the die-bonding the semiconductor chip to the adherend.