| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a structure for stably preventing warpage of a substrate in an MEMS device composed of a thin film on the substrate having a different thermal expansion coefficient.SOLUTION: An electronic apparatus includes a substrate 2 and a flat plate-like thin film 3 that is fixed to the substrate 2; and has a function of detecting a physical quantity through the displacement of thin film 3. The thin film 3 forms electrical wiring by: a conductor part including a conductive material 13 of a conductivity equal to or higher than that of semiconductor and lower than that of a metal material; and a metal material part including a metal material 14 that is electrically connected with the conductive material 13 at an end of the conductive part. The metal material part has, at least in part, a metal layer composed of a single layer structure of the metal material 14 in the thickness direction of the thin film 3.</p> |
