| 摘要 |
A system includes a high performance but very compact device and an associated docking station. The device may include a processor that is contained within a housing which defines a heat transmission surface that is thermally coupled to the processor and other heat generating components. The docking station includes a portion for receiving the housing of the device, a thermally conductive substrate defining a heat receiving surface, and an array of conductive fibers thermally coupled the heat transmitting surface to the heat receiving surface. This forms a dry low pressure thermal coupling interface capable of repeated thermal coupling and decoupling. This is advantageous relative to traditional semi liquid or liquid thermal compounds or compliant thermal pads which require high pressure or unreliable repetitive thermal coupling and decoupling. The thermal dissipation mechanism is therefore largely separated from the device and therefore it becomes very compact. |
