SEALING STRUCTURE FOR ELECTRONIC COMPONENT, AND FISCAL PRINTER

摘要

PROBLEM TO BE SOLVED: To provide a sealing structure for an electronic component which makes it hard to illegally access an electronic component such as a memory.SOLUTION: There is provided a sealing section 31 for an electronic component which has a resin curing layer 32 covering circuit elements 30 mounted on a substrate surface 13a, and a cover member 33. The cover member 33 sandwiches the resin curing layer 32, is attached to the resin curing layer 32 from the opposite side to the substrate surface 13a, and covers a region in which the circuit element 30 on the substrate surface 13a are arranged. It is hard to illegally access the electronic component compared to a case where only the resin curing layer has to be removed.