FLEX CIRCUIT HAVING A MULTIPLE LAYERED STRUCTURE AND INTERCONNECT

摘要

A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer. In one embodiment, the gimbal portion of the flex circuit includes the first layer and not the second layer of the multiple layer structure and in another embodiment a bending portion of the flex circuit includes the first base layer and not the second layer of the multiple layered structure to provide a reduced thickness to facilitate bending, for example in a micro-actuation region of the load beam.

主权项

1. A flex circuit comprising:
an elongate flexible structure including a first insulating layer and a second insulating layer; and one or more conductive traces and one or more bond pads on an obverse side of the structure coupled to the one or more conductive traces on the obverse side of the structure; and one or more interlayer conductive traces between the first and second layers and one or more interlayer bond pads coupled to the one or more interlayer traces protruding from an edge of the flexible structure to provide a reverse side bonding surface on a reverse side of the flexible structure.