Package on Packaging Structure and Methods of Making Same

摘要

A package on packaging structure provides for improved thermal conduction and mechanical strength by the introduction of a sold thermal coupler between the first and second packages. The first package has a first substrate and through vias through the first substrate. A first set of conductive elements is aligned with and coupled to the through vias of the first substrate. A solid thermal coupler is coupled to the first set of conductive elements and to a die of the second package. A second set of conductive elements is coupled to the die and a bottom substrate is coupled to the second set of conductive elements. The thermal coupler may be, e.g., an interposer, a heat spreader, or a thermal conductive layer.

主权项

1. A method of forming a package comprising:
receiving a first package, the first package including a first die on a first substrate, the first substrate having a plurality of thermal vias, the thermal vias being thermally coupled to a heat conductive path in the first substrate; receiving a second package, the second package including a second die on a second substrate; and thermally coupling the second die and the plurality of thermal vias using a thermal conductor, wherein the plurality of thermal vias pass no signals between the second die and the first die.