PRESSURE SENSOR DEVICE WITH GEL RETAINER

摘要

A pressure sensor device includes a gel retainer that is mounted or formed on a substrate. The gel retainer has a cavity and a pressure sensing die is mounted inside the cavity. The die is electrically connected to one or more other package elements. A pressure-sensitive gel material is dispensed into the cavity to cover an active region of the pressure sensing die. A mold compound is applied on an upper surface of the substrate outside of the gel retainer.

主权项

1. A method for assembling a packaged semiconductor device, the method comprising:
mounting or forming a gel retainer on a substrate, the gel retainer having a cavity formed therein; mounting a pressure-sensing die inside the cavity of the gel retainer; electrically connecting the pressure-sensing die to at least one other package element; and applying a pressure-sensitive gel material within the cavity of the gel retainer to cover at least an active region of the pressure-sensing die.