| 摘要 |
The present invention provides a 3D System ("3DS") MEMS architecture that enables the integration of MEMS devices with IC chips to form a System on Chip (So C) or System in Package (Si P). The integrated MEMS system comprises at least one MEMS chip, including MEMS transducers, and at least one IC chip, including not only MEMS processing circuitry, but also additional/auxiliary circuitry to process auxiliary signals. The MEMS and IC chips are bump bonded. The MEMS chip includes first and second insulated conducting pathways. The first pathways conduct the MEMS-signals between the transducers and the IC chip, for processing; and the second conducting pathways extend through the entire thickness of the MEMS chip, to conduct auxiliary signals, such as power, RF, I/Os, to the IC chip, to be processed the additional circuitry. |
