发热体、振动装置、电子机器及移动体;HEATING BODY, VIBRATION DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT

摘要

本发明提供一种可使所期望之区域高效率地发热之发热体、及可高效率地对振动片进行加热之振动装置、以及使用该发热体或该振动装置之电子机器及移动体。;发热用IC20包括：半导体基板21，其形成有扩散层22；焊垫26a，其用以向扩散层22施加电源电压；及焊垫26b，其用以向扩散层22施加接地电压。半导体基板21以于俯视半导体基板21时，与分别连结焊垫26a和焊垫26b之假想直线相交之方式具备狭缝23a、23b。; a first pad that applies a power source voltage to the diffusion layer; and a second pad that applies a ground voltage to the diffusion layer. A semiconductor substrate includes slits such that the slits intersect a virtual straight line connecting the pads when the semiconductor substrate is seen in a plan view.