发明名称 WIRE MATERIAL SUPPLY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wire material supply device capable of detecting that wire material supply is securely and normally performed without damaging a wire.SOLUTION: The wire material supply device is so configured that wire material feeding mechanism 3 that repeats feeding and stopping of a wire 50 and a pressure sensor 9 (noncontact sensor) that detects a movement of the wire 50 are provided, and, when a wire material feeding mechanism 3 is feeding out the wire 50 and when a predetermined width may not be obtained for a width of a change in detection value obtained by the pressure sensor 9, a control apparatus 2 determines that abnormality occurs in the feeding of the wire 50.
申请公布号 JP2015130772(A) 申请公布日期 2015.07.16
申请号 JP20140001968 申请日期 2014.01.08
申请人 SHIN MEIWA IND CO LTD 发明人 YAMAKAWA KENJI;KUNO MASARU;KUSANO HIROSHI
分类号 H02G1/06;B21F11/00;B21F23/00;B65H63/06;G02B6/46 主分类号 H02G1/06
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