| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a component built-in substrate capable of achieving high density of a component and wiring.SOLUTION: Disclosed is a method of manufacturing a component built-in substrate 10, in which an electronic component 13 is mounted on a predetermined member in which a first layer 11 capable of being peeled off is provided on the surface, a second layer 15 embedding the electronic component therein is further laminated on the first layer, the predetermined member is peeled off and removed from a laminate 17 formed by laminating the second layer on the first layer, and the first layer is penetrated from the surface from which the predetermined member is removed, out of the surface of the laminate, to form a via 18 conductive to the electronic component. |
