发明名称 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
摘要 A method of manufacturing a semiconductor device is provided. The method includes forming a fin structure on a semiconductor substrate and forming a well region in the semiconductor substrate by ion implantation so as to form transistors. The transistors include a pull-up transistor, a transfer gate transistor, and a pull-down transistor of a SRAM cell. The ion implantation is used to adjust threshold voltages of the transistors. Standard threshold voltage (SVt) ion implantation conditions are used to adjust a threshold voltage of the pull-up transistor and a threshold voltage of the transfer gate transistor, and low threshold voltage (LVt) ion implantation conditions are used to adjust a threshold voltage of the pull-down transistor.
申请公布号 US2015200194(A1) 申请公布日期 2015.07.16
申请号 US201514591716 申请日期 2015.01.07
申请人 Semiconductor Manufacturing International (Shanghai) Corporation 发明人 JU Jianhua;ZHANG Shuai
分类号 H01L27/11;H01L29/66 主分类号 H01L27/11
代理机构 代理人
主权项 1. A method of manufacturing a semiconductor device, comprising: forming a fin structure on a semiconductor substrate; and forming a well region in the semiconductor substrate by ion implantation so as to form transistors, wherein the transistors include a pull-up (PU) transistor, a transfer gate (PG) transistor, and a pull-down (PD) transistor of a static random-access memory (SRAM) cell; the ion implantation being used to adjust threshold voltages of the transistors, wherein standard threshold voltage (SVt) ion implantation conditions are used to adjust a threshold voltage of the PU transistor and a threshold voltage of the PG transistor, and low threshold voltage (LVt) ion implantation conditions are used to adjust a threshold voltage of the PD transistor.
地址 Shanghai CN